The increasing demand for extremely high-data-rate communications has urged researchers to develop new communication systems. Currently, wireless transmission with more than one Giga-bits-per-second (Gbps) data rates is becoming essential due to increased connectivity between different portable and smart devices. To realize Gbps data rates, millimeter-wave (MMW) bands around 60 GHz is attractive due to the availability of large bandwidth of 9 GHz.

Recent research work in the Gbps data rates around 60 GHz band has focused on short-range indoor applications, such as uncompressed video transfer, high-speed file transfer between electronic devices, and communication to and from kiosk. Many of these applications are limited to 10 m or less, because of the huge free space path loss and oxygen absorption for 60 GHz band MMW signal.

This book introduces new knowledge and novel circuit techniques to design low-power MMW circuits and systems. It also focuses on unlocking the potential applications of the 60 GHz band for high-speed outdoor applications. The innovative design application significantly improves and enables high-data-rate low-cost communication links between two access points seamlessly. The 60 GHz transceiver system-on-chip provides an alternative solution to upgrade existing networks without introducing any building renovation or external network laying works.

Kaixue Ma is a full professor in the University of Electronic Science and Technology of China (UESTC). He received his B.E. and M.E. degrees from Northwestern Polytechnical University (NWPU), China, and Ph.D from Nanyang Technological University (NTU), Singapore. From 1997 to 2002, he was with the China Academy of Space Technology (Xi’an), where he was Group Leader of millimeter-wave group for space-borne microwave and millimeter-wave (MMW) components and subsystems for satellite payload and very small aperture terminal (VSAT) ground station. From 2005 to 2007, he was with MEDs Technologies as an R&D manager, where he provided design services and product development. From 2007 to 2010, he was with ST Electronics as an R&D manager. From 2010 to 2013, he was a senior research fellow and team leader of radio frequency–integrated circuit (RFIC)/MMW group researching on 60 GHz design at NTU. He is a senior member of IEEE, has filed 13 patents and authored/co-authored over 150 international top-tier refereed journal and conference papers. He received the Best Paper Award in IEEE SOCC2011, IEEK SOC Design Group Award, Chip Design Competition Bronze Award in ISIC2011, and the "Special Mention" Award under Emerging Technologies Category Awards for Singapore’s Next Generation WiFi Chipset in 2012 by Singapore Infocomm Technology Federation (SiTF). Prof. Ma has been honored with the National "Thousand Talent Program" Award from China.

Kiat Seng Yeo is associate provost (Graduate Studies and International Relations) at Singapore University of Technology and Design (SUTD). He received his B.Eng. and Ph.D in electrical engineering in 1993 and 1996, respectively, from NTU. He is member of board of advisors of the Singapore Semiconductor Industry Association and is a widely known authority in low-power RF/MMW IC design and a recognized expert in complementary metal-oxide semiconductor technology. Before his appointment at SUTD, he was associate chair (Research), Head of Division of Circuits and Systems, and founding director of Virtus of the School of Electrical and Electronic Engineering at NTU. He has published 6 books, 5 book chapters, over 500 international top-tier refereed journal and conference papers, and holds 35 patents. Prof. Yeo holds/has held key positions in many international conferences as advisor, general chair, co-general chair and technical Chair. He was awarded the Public Administration Medal (Bronze) on National Day 2009 by the President of the Republic of Singapore and was also awarded the distinguished Nanyang Alumni Award in 2009 for his outstanding contributions to the university and society. Prof. Yeo is an IEEE Fellow for his contributions to low-power IC design.